From silicon to ship — with AI inside.
Twelve disciplines across hardware, firmware, software, on-device AI, and production. We don't just route boards — we make them intelligent. No agency hand-offs, no scope creep, no slide decks. Just engineering that makes it to a customer's desk.
Electronics, PCB, power, RF.
Electronics design
Schematic capture, part selection, mixed-signal circuits. Analog front-ends, SMPS, sensor interfaces, power budgeting, ERC-clean nets.
PCB design & layout
2–12 layer boards. HDI, controlled impedance, DDR routing, EMC-aware floorplans, thermal management. DFM-clean and ready for assembly.
Power & RF
Battery management, solar & energy harvesting, antenna tuning, impedance matching, FCC/CE pre-compliance scans on the bench.
Bare-metal to RTOS, wireless, edge AI.
Embedded firmware
Bare-metal and RTOS on STM32, ESP32, nRF52, RP2040. Drivers, bring-up, A/B OTA, secure boot, low-power state machines.
BLE & wireless
BLE 5.x, BLE Mesh, LoRaWAN, Wi-Fi, LTE-M, Thread, Matter, GSM/4G modems. Pairing UX and OTA flows that survive the field.
AI on edge · hardware × intelligence
Coaching analyzers, gesture/voice classifiers, anomaly detection, sensor-fusion models — running on MCU-class silicon. Where your product stops being a sensor and starts making decisions.
Mobile, web, cloud, consulting.
Mobile & web apps
Companion apps for connected hardware. BLE pairing, MQTT dashboards, OTA flows, account & device-onboarding journeys that don't drop calls.
Cloud & IoT backend
AWS IoT Core, Firebase, MQTT brokers, Node.js backends, Grafana telemetry. Fleet management, OTA campaigns, and analytics pipelines.
Tech consulting
Architecture review, technical due diligence, BOM/DFM second opinions, certification roadmaps. Useful before you raise, hire, or commit.
Mechanical, DFM, certification.
Mechanical & enclosure
CAD modeling, tolerance analysis, FDM/SLA iterations, injection-mold prep, fixture and jig design for production lines.
Prototype → production
DFM/DFA review, BOM optimization, contract-manufacturer coordination. We stay on the bench until first-article parts match spec.
Certification & compliance
FCC, CE, RED, UL, IEC 62304, BLE SIG, MIC. Strategy designed in from day one — pre-scan EMC, creepage/clearance, paperwork.